Heat-dissipating plate

ABSTRACT

A heat-dissipating plate has a casing and a supporting structure, where the casing has surrounding walls to define a receiving compartment therein confined by an inner wall. The inner wall is integrated with a capillary structure. Disposed inside the receiving compartment, the supporting structure includes a meshed partition and a plurality of columns. The meshed partition has a plurality of holes and joined-openings. The columns are fixed in the joined-openings and abut against the inner surface of the walls. The associated manufacturing process for the heat-dissipating plate is easily to accomplish.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The instant disclosure relates to a heat-dissipating plate; and moreparticularly to a novel heat-dissipating device including a flattenedcasing tightly coupled to a supporting structure therein to achieve goodthermal conductivity.

2. Description of Related Art

A flat heat pipe is usually made of copper sheet and configured intoclosed hollow casing, in which the hollow portion is vacuum and filledwith working fluids. A capillary structure is formed on an inner wall ofthe casing. However, during the vacuuming process, it is difficult tocontrol the plane surface of the heat pipe. Thus, a supporting structureis usually inserted into the hollow casing to maintain the plane surfaceof the heat pipe. Some conventional supporting structure uses a coppernet having a wavy-shaped supporting surface formed thereon to supportthe upper and the bottom walls of the hollow casing. Other conventionalsupporting structures employ a plurality of supporting columns fixedtherein.

However, the copper net requires treatments to form a plurality of wavysupporting structure thereon to be used as a supporting structure. Thus,the required manufacturing process becomes more complex. On the otherhad, if supporting columns are used as the supporting structure, asoldering process is required to couple the columns to an upper and alower wall of the heat pipe. The coupling process is also inconvenientand incurs high production costs.

Because of the technical limitations described above, the applicantstrives via experience and academic research to develop the instantdisclosure, which can effectively improve the limitations describedabove.

SUMMARY OF THE INVENTION

The object of the instant disclosure is to provide a heat-dissipatingplate having a flattened casing which received a supporting structuretherein.

Another object of the instant disclosure is to provide a supportingstructure including a meshed partition which is combined with aplurality of columns.

A further object is to provide a capillary structure formed on an innerwall of the casing and the columns of the supporting structure.

To further appreciate the characteristics and technical contents of theinstant disclosure, references are hereunder made to the detaileddescriptions and appended drawings in connection with the instantdisclosure. However, the appended drawings are merely shown forexemplary purposes, rather than being used to restrict the scope of theinstant disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of a heat-dissipating plate for the instantdisclosure.

FIG. 2 is an isometric view of a supporting structure for he instantdisclosure.

FIG. 3 is a side view of the supporting structure for the instantdisclosure.

FIG. 4 is an enlarged view of a portion of the supporting structure,

FIG. 5 is a cross-sectional view of the heat-dissipating plate prior toflatten the casing.

FIG. 6 is a cross-sectional view of a flattened heat-dissipating plate.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENT

Please refer to FIG. 1, which shows a heat-dissipating plate accordingto the instant disclosure. The instant disclosure provides aheat-dissipating plate 1, which includes a casing 11 and a supportingstructure 12.

The casing 11 has surrounding walls 111. The surrounding walls 111 areformed with a capillary structure 111 a therein. The inner surface ofthe surrounding walls 111 defines a receiving compartment 112. A workingfluid, such as water . . . etc., is filled in the receiving compartment112. The capillary structure 111 a formed on the walls 111 could beformed with copper powder.

The supporting structure 12 includes a meshed partition 121 and aplurality of columns 122. The meshed partition 121 could be made from acopper plate by punching. The meshed partition 121 has a plurality ofholes 1211 and a plurality of joined-openings 1212. The joined-openings1212 are slightly wider than the holes 1211. The meshed partition 121has a plurality of fixing tabs 1213 extended from the inner edge of eachjoined-opening 1212. Each fixing tab 1213 has a hook-shaped body forretaining the column 122, but the retaining structure is not limitedthereto. As shown in FIG. 4, a included angle is formed between thefixing tabs 1213 and the meshed partition 121. In other words, thefixing tabs 1213 are tilted and extended from a rim surrounded thejoined-opening 1212 of the meshed partition 121. The columns 122 areplugged into the joined-openings 1212 respectively, where the fixingtabs 1213 secure the columns 122 onto the meshed partition 121. The topand bottom end surfaces of each column 122 abut on the surrounding wall111.

Therefore, when the heat-dissipating plate 1 is placed on aheat-generating member (not shown), heat is conducted from the bottom totop portion of the surrounding wall 111 via each column 122. Theheat-dissipating plate 1 provides excellent heat transfer, and theassociated manufacturing process is easier accomplished.

Also, a capillary structure (not shown) can be formed on a periphery ofthe columns 122.

As shown in FIG. 5, a casing 11 could be a flatten oval-shaped tubing.The supporting structure 12 could be installed directly into thereceiving compartment 112. Then, the casing 11 is flattened, and thereceiving compartment 112 is vacuumed, filled with the working fluid,and sealed. As shown in FIG. 6, a flatten heat-dissipating plated isfinished with the supporting structure inserted in the flatten casing.

The present disclosure at least has efficacy and the characteristics asfollowed.

1. The instant disclosure provides a heat-dissipating plate, a new kindof flat heat pipe, which is inserted with the supporting structure tosupport the casing. It is easily to control the horizontal level of thesurfaces of the heat-dissipating plate. Thus, the heat-dissipating platecan be mounted with a heat-producing element well.

2. The supporting structure is a good supporter for the casing ofheat-dissipating plate, and can strengthen the heat-dissipating plate.

3. The manufacturing process of the heat-dissipating plate is easier. Itcan be easily started from a flattened elliptic tube as the casing, andinsert the supporting structure into the casing. Then, to proceed toother processes for achieving the heat-dissipating plate, such asflattening, vacuuming, infusing working fluid, and sealing openings . .. etc.

The descriptions illustrated supra set forth simply the preferredembodiment of the instant disclosure; however, the characteristics ofthe instant disclosure are by no means restricted thereto. All changes,alternations, or modifications conveniently considered by those skilledin the art are deemed to be encompassed within the scope of the instantdisclosure delineated by the following claims.

1. A heat-dissipating plate, comprising a casing having surroundingwalls, wherein the walls are formed with capillary structure therein,wherein the inner surface of the surrounding walls defines a receivingcompartment; and a supporting structure disposed in the receivingcompartment, wherein the supporting structure includes a meshedpartition and a plurality of columns, wherein the meshed partition has aplurality of holes and joined-openings, and wherein the columns arefixed in the joined-openings respectively, and wherein the columns abutagainst the inner surface of the surrounding wall.
 2. Theheat-dissipating plate of claim 1, wherein the casing isflattened-shaped.
 3. The heat-dissipating plate of claim 1, wherein thecapillary structure is formed with copper powders.
 4. Theheat-dissipating plate of claim 1, wherein the meshed partition is madefrom a copper plate by punching.
 5. The heat-dissipating plate of claim1, wherein the meshed partition is extended with a plurality of fixingtabs from an inner edge of each joined-opening to hold the column. 6.The heat-dissipating plate of claim 5, wherein the fixing tabs and themeshed partition are formed with an included angle therebetween.
 7. Theheat-dissipating plate of claim 6, wherein the fixing tab has ahook-shaped body to hold the column.
 8. The heat-dissipating plate ofclaim 1, wherein the fixing tab has a hook-shaped body to hold thecolumn.
 9. The heat-dissipating plate of claim 1, wherein each of thecolumns is formed with a capillary structure on a periphery thereof.